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Accelerate Your Technology with Aptek Industries

Aptek Industries is thrilled to unveil our groundbreaking expansion in service offerings. With the introduction of our state-of-the-art vertical integration program, we've embarked on a journey that redefines what's possible in semiconductor solutions.

Picture this: from raw, bare silicon to the most intricate dicing and packaging requirements, we've got you covered. Our expanded services now encompass lapping services for even the toughest materials like Sapphire, Quartz, and Silicon Carbide, offering alternative surface finishes for softer materials, broadening our scope far beyond just wafers.

Once your wafers are expertly thinned, we seamlessly transition to backside metal processing, ensuring every facet of your project is executed flawlessly. Then, the world of dicing unfolds before you, with a multitude of options tailored to your packaging needs. Whether it's precision dice into waffle packs, gel packs, or the convenience of leaving diced wafers on a frame – consider it done.

To make it even more exciting, our new quick quote page empowers you to effortlessly select the services you need, and with a few clicks, you're on your way. Our advanced algorithms will swiftly generate a Total Solution Quote based on your preferences. In the rare event that we need more details, we'll reach out to you for clarification.

Aptek Industries is not just redefining the semiconductor service landscape; we're rewriting the future of possibilities. Join us in this exhilarating journey toward cutting-edge solutions, where innovation knows no bounds, and your vision becomes our mission. Welcome to the future of semiconductor services with Aptek Industries.


Aptek Industries is catapulting into the future, offering a comprehensive suite of services, from lapping of diverse materials to precision dicing and packaging solutions, all seamlessly integrated through our state-of-the-art vertical integration program. Experience the innovation and convenience of our services – it's a new era in semiconductor solutions.


Experience the Future of Precision with Aptek's Super-Abrasive Lapping Technology. Our cutting-edge approach combines state-of-the-art slurries and ultra-precision single and double-sided lapping equipment, guaranteeing the flattest, most precise solutions available today. Our fully equipped manufacturing and abrasive-processing shop, staffed by experienced operators, is ready to transform your parts with unmatched precision, ensuring they meet or exceed your specifications. Whether it's one-of-a-kind specialty parts, challenging prototype projects, or short-run parts demanding special handling, materials, or processing, Aptek Industries is your gateway to precision engineering that breaks boundaries.


In the ever-evolving world of semiconductors, the demand for ultra-thin wafer packaging has never been greater. Mechanical backgrinding, the industry standard for wafer thinning, has long been valued for its cost-effectiveness and productivity. However, as the industry pushes the boundaries, requiring wafers thinner than 100 μm, new challenges arise, from wafer/die bow and mechanical strength to handling, total thickness variation (TTV), dicing, and packaging assembly.

Enter our cutting-edge ultrathin wafer processing and assembly technologies, designed to conquer these challenges head-on. We've developed innovative solutions such as specialized wafer carrier systems, subsurface damage reduction, enhanced wafer carrier flatness, and precise backgrinding auto-TTV control, all contributing to superior tensile die strength for flexible packaging applications.

But that's not all – we're thrilled to introduce our latest breakthrough service: the 4000 grit ultra-fine grind process for 150mm, 200mm, and 300mm wafers. With this process, we're successfully thinning 300mm wafers down to an astonishing 8 mils. The best part? This service offers the benefits of a polished wafer at a significantly lower cost, making it an ideal choice for applications demanding thinner wafers in high-stress environments, such as smart cards.

Our customers are already experiencing remarkable results, with yield increases of over 50% during initial assembly testing and outstanding life cycle improvements post-deployment. Join us in embracing the future of semiconductor technology with Aptek Industries – where innovation meets precision, and your success is our priority!

Grind & CMP Polish

At Aptek, we're revolutionizing the world of semiconductor technology by perfecting the art of diode removal from the wafer's backside and achieving the ideal thickness for flatpac packaging. With our exclusive proprietary processes, we have the power to transform wafers ranging from a compact two inches to a substantial twelve inches (50-300 mm) in diameter, slimming them down to an astonishing 4 mils (100 microns) with an unrivaled tolerance of just 0.5 mils (12 microns) – all guaranteed!

But that's not all – our services extend to the realms of backside polishing, reaching an astonishing thickness down to a mere 1 mil (25-30 microns), alongside expert backside gold removal and the precision grinding of a diverse array of materials, including ceramic substrates, germanium, sapphire, gallium arsenide, and many more.

Experience a new era in semiconductor transformation with Aptek Industries – where the possibilities are endless, and precision is our promise. Welcome to a future where your wafer dreams become a reality!

Backside Metal Deposition

We specialize in the following services:

  • Thin Film Deposition, using sputtering and electron-beam systems.

  • All Standard Semiconductor Metallizations

  • Sintering

  • Film Thickness Measurements

  • Spectrophotometer

  • Dielectrics & Anti-Reflective Coatings

  • Evaporated Films

  • Multi-Metal Systems

  • Electron Beam Evaporation & Sputtering

  • Cleanroom & Processing Labs

  • Large Capacity Evaporators with 12" Wafer Capability

Edge Grinding

In the world of semiconductor manufacturing, Edge Grinding, also known as Edge Profiling, is the unsung hero, serving as the backbone of not only semiconductor wafers but also the foundation for processes involving materials like Sapphire, Quartz, Alumina, and Silicon Carbide.

Why is it so crucial, you ask? Well, think of it as the guardian angel of your wafers. Silicon, in its crystalline state, is inherently brittle. Without proper profiling and rounding at the edges, your wafers are at risk of cracking or breaking, not just during handling but also in subsequent processing steps. The battle against thermal fluctuations and the perils of robotic handling can be won with the magic touch of a well-rounded or notched edge.

So, let's talk! Share your concerns and requirements with us, and discover how Aptek Industries can be your knight in shining armor. We're here to turn your specifications into reality, ensuring the safety and survival of your wafers in a world where precision makes all the difference. Welcome to the future of edge perfection with Aptek Industries!

Laser Services

Our laser technology prowess extends to laser etching, laser marking, and laser engraving, ensuring your in-process or finished components bear a lasting, indelible message.

Picture this: text, serial numbers, part numbers, company logos, bar codes, QR Codes, ID matrix codes, or 2D codes, all expertly etched onto silicon wafers of any diameter. But it doesn't stop there – our laser wizardry also embraces plain, painted, anodized, or plated metal surfaces, be they flat sheets, gracefully curved surfaces, or even sleek cylinders.

And when it comes to glass materials, our laser engraving achieves nothing short of perfection. Our systems can mark characters as small as 0.010 inch or as grand as 12 inches, ensuring your projects exude unparalleled precision and quality.

But here's where it gets even more exciting – our SEMI OCR font opens doors to effortless alphanumeric data marking on wafer surfaces, complete with automatic Optical Character Reading (OCR). It's all designed in perfect harmony with the SEMI M12/M13-1103 standard, ensuring the utmost compliance and accuracy.

So, why settle for ordinary marks when you can etch your legacy with laser precision? Join us in shaping the future of marking technology at Aptek Industries!

Tape Mount

Our frame-mounted adhesive tape technology is your passport to a world of dicing and mounting excellence, where precision and innovation go hand in hand.

Imagine tape that adheres your wafer securely enough to withstand the rigors of dicing and cleaning, yet makes die removal a breeze. With meticulous care, we unwind tape from a roll and mount it to your wafer and frame, maintaining a consistent temperature and pressure. Our frames are equipped with orientation notches, ensuring perfect alignment with your wafer's flat or orientation notch.

But here's where it gets thrilling – the circuit side of your wafer stays protected, safeguarding delicate structures. No air is trapped during tape application, and we ensure equal tension in all directions, preventing any unwanted shifts during the dicing process.

And that's not all – we offer a range of cutting-edge options for mounting tape, including thermal release and UV light release. Aptek Industries is your gateway to a future where wafer handling is an art form, blending precision, technology, and innovation seamlessly. Welcome to the world of wafer mounting redefined!


Wafer dicing, the art of transforming wafers into individual die pieces, reaches new heights with our cutting-edge methods. At Aptek, we offer both mechanical and laser dicing, each promising unparalleled precision and innovation.

Our mechanical dicing saws are true workhorses, effortlessly handling wafers up to a whopping 12 inches in diameter. With a positional accuracy of better than 5 microns and the ability to achieve a cut width as small as 20 microns, these tools rise above the rest, tackling most dicing and grooving needs with cost-effective finesse, especially for hard and brittle materials.

But that's not all – our laser capabilities include the revolutionary Synova tool, where water acts as an optical guide, directing the laser beam with pinpoint accuracy. The result? A cut with minimal heat damage, no material redeposition, and remarkably straight sidewalls. This technique is often used for wafer coring, where larger wafers give birth to smaller ones, multiplying possibilities.

And here's the game-changer – our Dicing Before Grinding (DBG) process. While the traditional sequence involves thinning the wafer and then dicing it, DBG turns the tables by dicing into the wafer without going through it. The result? Die pieces released during the backgrinding process with minimal backside chipping.

Join us in exploring the future of wafer dicing, where precision, innovation, and limitless possibilities converge at Aptek Industries!

Customer Service

Prepare to be captivated by a level of service that's nothing short of 5-star excellence. At Aptek Industries, we've redefined the art of customer service to create an elite experience exclusively for you.

From the very first moment you engage with us, you'll enter a world of unparalleled sophistication and expertise. Our team of consummate professionals is dedicated to ensuring that every aspect of your journey with us is nothing less than exceptional.

We don't just meet your needs; we anticipate them. Your projects are our passion, and we leave no stone unturned to provide personalized, precision-crafted solutions that exceed even the loftiest expectations.

Join the ranks of our elite clientele who've savored the Aptek difference. Welcome to a realm where every interaction is a masterpiece of service, where your success is our sole focus. Elevate your experience with the elite service you deserve, only at Aptek Industries!

Collaborative Partnerships

We believe in building collaborative partnerships with our clients. Our team works closely with our clients to understand their needs and provide solutions that meet their goals. We are committed to ensuring that our clients receive the support and guidance they need to succeed.

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