Unlocking Tomorrow's Technology: The Aptek Industries Experience

How to determine which Bonding and De-Bonding Method is best for your process.

Brewer Sciences has a wonderful article of various methods of De-bonding your wafers from a handle wafer. https://semiengineering.com/pho...

Is there a difference in diamond slurries?

PC diamond (Polycrystalline Diamond) and MA diamond (Monocrystalline Diamond) slurries are two types of diamond slurries used in the...

Are Your Silicon Wafers Being Ground Properly?

Grinding of silicon wafers is a crucial step in the semiconductor manufacturing process, which involves the production of integrated...

Use Of Oxidizers In Your CMP Process

Oxidizers play a crucial role in CMP polishing processes. Here's an explanation of their use: Oxidizers in Slurry Composition: CMP...

Do you have the correct hardness in your CMP polishing pads?

In the Chemical Mechanical Polishing (CMP) process, polishing pads play a crucial role in achieving the desired surface finish on...

Have You Considered Particle Size Control In Your CMP Slurry?

The size and shape of particles in polishing slurries play a crucial role in determining the efficiency and effectiveness of the...

Polishing considerations for Borosilicate Glass

Lapping and polishing slurries play a crucial role in the process of finishing and polishing materials like Borofloat glass. Borofloat...

Welcome to the Future of Semiconductor Excellence with Aptek Industries

In the ever-evolving world of semiconductors, precision is paramount, and innovation is the driving force. At Aptek Industries, we have...

Aptek currently has two locations to service your thinning and polishing needs.