Frequently Asked Questions

Q: What is the difference between Lapping and Backgrinding?
A: The two terms mean the same thing, just differ in the type of machine used. The basic principle of a lap or grind is to remove material to a specified thickness.

Q: Is a fine grind the same as a polish?
A: No. While a fine grind will give a specular (mirror like) finish, it does not achieve what a CMP polish does, to relieve the stress on the wafer created during the back grind process. The experts at Aptek will be more than happy to discuss your requirements and the best solution to fit them.

Q: Your website states that you have 5 different types of grind finishes. Why is that?
A: During Aptek’s 21 years in the grind and polish industry, we have found that customers have different requirements for their devices after the grind and/or Grind and Polish. We would be happy to discuss your requirements with you.

Q: Do you offer dicing, backside metallization or packaging?
A: Aptek can provide these services through qualified sub contractors who have years of experience in these areas. Aptek will present a single quote and invoice to the customer for all jobs, simplifying the process for your purchasing department. We recommend our customers work directly with the subcontractors for technical requirements.